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Infinix creates a “3D Vapor Cloud Chamber”, which improves conventional designs by 3°C

Infinix has developed an improved vapor chamber cooling system that it calls “3D Vapor Cloud Chamber” (3D VCC). Compared to conventional designs, it reduces chipset temperature by 3°C, according to the company. It does this by improving the contact between the chipset and the vapor chamber itself. Phone VCs are usually flat, requiring the use of thermal paste (or similar material) to mate the chipset and VC. The 3D VCC design has a “bump” that leaves only the smallest gap between the chamber and the chipset. The hump has an added benefit – it increases the internal volume of the VC, which means it can hold more water. This design was promising but presented some challenges. Since vapor chambers are purely passive elements, they rely on wicking material to transfer condensed water from the cold part of the phone to the hot areas where it can evaporate again (and carry the heat away with she). The bump disrupted the normal flow, so Infinix’s R&D team had to find a way to restore it. The solution was to use a sophisticated capillary structure and an advanced soldering technique. Today, the company is looking for ways to further improve this design. He wants to make 3D VCCs thinner and give them more bumps, so they can also effectively cool other heat-generating components. The company is also researching new materials and integrating 3D VCC into the phone’s middle frame. Source

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